Friction Riveting of FR4 substrates for printed circuit boards: Influence of process parameters on process temperature development and joint properties


This work investigates the influence of Friction Riveting processing conditions on FR4-PCB substrate/AA2024 rivet joints in terms of process temperature evolution, joint formation, and joint physical-chemical and mechanical properties. The joints were manufactured using 4 mm diameter AA-2024-T3 rivets and FR4 laminates of 1.5 mm thickness with single or double copper-clad layers. The evolution of process temperature evolution was recorded on the FR4 substrate surface and correlated with the resulting joint formation. Most joints obtained with double copper clad layers developed process temperatures above 300 ºC, whereas joints produced with a single copper clad presented slightly lower temperatures, but still above 250 ºC. Rivet anchoring was achieved for both FR4 material combinations in the configuration of a single-base laminate, as well as two and even three overlapped laminates. Thermogravimetric analyses revealed that above 300 ºC intensive thermal degradation occurs on FR4 materials (with 30% mass change), followed by decomposition, resulting in non-uniform heat distribution throughout the thickness. The joint ultimate tensile force was higher for double copper-clad layers and the joints achieved within more than one laminate, showing higher anchoring efficiency.
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