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Diffusion bonding of TiAl using Ni/Al multilayers

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  • URL: https://publications.hereon.de/id/28277/
  • Authors:Simoes, S., Viana, F., Ventzke, V., Kocak, M., Ramos, A.S., Vieira, M.T., Vieira, M.F.
  • Year:2009
  • In: European Congress on Advanced Materials and Processes, EUROMAT 2009
  • Location:Glasgow (GB)
  • Date:07.-10.09.2009
  • Cite as: Simoes, S.; Viana, F.; Ventzke, V.; Kocak, M.; Ramos, A.S.; Vieira, M.T.; Vieira, M.F.: Diffusion bonding of TiAl using Ni/Al multilayers . In: European Congress on Advanced Materials and Processes, EUROMAT 2009. Glasgow (GB), 07.-10.09.2009, 2009. (DOI: 10.1007/s10853-010-4303-0)
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