Diffusion bonding of TiAl using Ni/Al multilayers

conference lecture

No abstract available.

URL: https://publications.hereon.de/id/28277/
Authors:Simoes, S.,Viana, F.,Ventzke, V.,Kocak, M.,Ramos, A.S.,Vieira, M.T.,Vieira, M.F.
Year:2009
In: European Congress on Advanced Materials and Processes, EUROMAT 2009
Location:Glasgow (GB)
Date:07.-10.09.2009
Type:conference lecture
Cite as: Simoes, S.; Viana, F.; Ventzke, V.; Kocak, M.; Ramos, A.; Vieira, M.; Vieira, M.: Diffusion bonding of TiAl using Ni/Al multilayers. European Congress on Advanced Materials and Processes, EUROMAT 2009. Glasgow (GB), 2009. DOI: 10.1007/s10853-010-4303-0