Abstract
The metallurgical factors governing the solid-state diffusion bonding of TiAl alloys have been characterized using scanning electron microscopy together with energy-dispersive X-ray (EDX) spectroscopy and electron backscattered diffraction (EBSD) analysis. The investigations were performed on TiAl alloys with various compositions and microstructures, which had been thoroughly mechanically characterized. The process zone of the bonds typically consists of a fine-grained layer of α 2(Ti3Al) phase at the former contact plane, followed by relatively large, defect-free γ(TiAl) grains and a region of deformed parent material. The evolution of the process zone involves phase transformation and recrystallization processes, which are triggered by asperity deformation at the contact plane and the unavoidable contamination of the diffusion couple with oxygen and nitrogen. The structural details depend on the alloy composition and the bonding conditions. In the final section of the article, technical aspects, including the tensile strength of diffusion bonds, will be discussed.
DOI Link to Publication