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Confpaper
Creep Behavior and Microstructural Changes During Short-Term Creep in a y-TiAl Based Alloy with Fully Lamellar Microstructure
No abstract available.
URL:
https://publications.hereon.de/id/22693/
Authors:
Chatterjee, A., Clemens, H., Dehm, G., Mecking, H., Kestler, H., Arzt, E.
Year:
2003
In:
Gamma Titanium Aluminides, TMS Annual Meeting 2003
Location:
San Diego, CA (USA)
Date:
02.-06.03.2003
Pages:
425 - 430
Type:
Confpaper
ISBN:
0-87339-543-3
Cite as:
Chatterjee, A.; Clemens, H.; Dehm, G.; Mecking, H.; Kestler, H.; Arzt, E.: Creep Behavior and Microstructural Changes During Short-Term Creep in a y-TiAl Based Alloy with Fully Lamellar Microstructure. In: Kim, Y.-W.; Clemens, H.; Rosenberger, A.H. (Eds.): Gamma Titanium Aluminides, TMS Annual Meeting 2003. San Diego, CA (USA), 02.-06.03.2003, 2003. 425 - 430. (ISBN: 0-87339-543-3)
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