Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil

journal article

No abstract available.

URL: https://publications.hereon.de/id/21978/
Authors:Duan, H.,Kocak, M.,Bohm, K.-H.,Ventzke, V.
Year:2004
In: Science and Technology of Welding and Joining
Volume:9
Issue:6
Pages:525-531
Type:journal article
ISSN: 1362-1718
Cite as: Duan, H.; Kocak, M.; Bohm, K.; Ventzke, V.: Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil. Science and Technology of Welding and Joining. 2004. vol. 9, no. 6, 525-531. DOI: 10.1179/136217104225021869