Transient Liquid Phase (TLP) Bonding of TiAl Using Various Insert Foils

journal article

No abstract available.

URL: https://publications.hereon.de/id/21977/
Authors:Duan, H.,Bohm, K.-H.,Ventzke, V.,Kocak, M.
Year:2004
In: Science and Technology of Welding and Joining
Volume:9
Issue:6
Pages:513-518
Type:journal article
ISSN: 1362-1718
Cite as: Duan, H.; Bohm, K.; Ventzke, V.; Kocak, M.: Transient Liquid Phase (TLP) Bonding of TiAl Using Various Insert Foils. Science and Technology of Welding and Joining. 2004. vol. 9, no. 6, 513-518. DOI: 10.1179/136217104225021850