@misc{cam_investigation_into_2006, 
author={Cam, G., Ipekoglu, G., Bohm, K.-H., Kocak, M.},
title={Investigation into the microstructure and mechanical properties of diffusion bonded TiAl alloys},
year={2006},
howpublished = {journal article},
doi = {https://doi.org/10.1007/s10853-006-0292-4},
abstract = {Sound joining of these alloys is a fundamental prerequisite for their successful integration into high temperature aerospace applications. It has been well demonstrated that diffusion bonding, a commonly used joining technology in conventional Ti-alloys, can successfully be used in joining of TiAl alloys both in as-cast or special-rolled conditions. In this study, diffusion bondability of a recently developed C containing TiAl alloy with a duplex microstructure using bonding parameters in the range of commercially available equipments was studied. Microstructural investigations in the joint area of the bonds were conducted to observe the presence of any weld defect. Additionally, the mechanical behaviour of the bonds was determined by shear testing to find out the optimum bonding parameters. Furthermore, the effect of post-bond heat treatment on the mechanical properties was investigated.},
note = {Online available at: \url{https://doi.org/10.1007/s10853-006-0292-4} (DOI). Cam, G.; Ipekoglu, G.; Bohm, K.; Kocak, M.: Investigation into the microstructure and mechanical properties of diffusion bonded TiAl alloys. Journal of Materials Science. 2006. vol. 41, no. 16, 5273-5282. DOI: 10.1007/s10853-006-0292-4}}