%0 journal article
%@ 1362-1718
%A Duan, H., Kocak, M., Bohm, K.-H., Ventzke, V.

%D 2004
%J Science and Technology of Welding and Joining
%N 6
%P 525-531 
%R doi:10.1179/136217104225021869
%T Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil
%U https://doi.org/10.1179/136217104225021869
6 
%X