@misc{duan_transient_liquid_2004, 
author={Duan, H.,Kocak, M.,Bohm, K.-H.,Ventzke, V.},
title={Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil},
year={2004},
howpublished = {journal article},
doi = {https://doi.org/10.1179/136217104225021869},
note = {Online available at: \url{https://doi.org/10.1179/136217104225021869} (DOI). Duan, H.; Kocak, M.; Bohm, K.; Ventzke, V.: Transient Liquid Phase (TLP) Bonding of TiAl/Ti6242 with Ti-Cu foil. Science and Technology of Welding and Joining. 2004. vol. 9, no. 6, 525-531. DOI: 10.1179/136217104225021869}}